HT Syndication

Exclusive

Category

Source

Publication

Byline

Location

INTERNATIONAL PATENT: ENEOS CORPORATION, ＥＮＥＯＳ株式会社 FILES APPLICATION FOR "MEASURING DEVICE AND DIAGNOSTIC SYSTEM"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- ENEOS CORPORATION (1-2, Otemachi 1-chome, Chiyoda-ku, Tokyo1008162), ＥＮＥＯＳ株式会社 (東京都千&#2019... Read More

INTERNATIONAL PATENT: BRIDGESTONE CORPORATION, 株式会社ブリヂストン, NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, 国立研究開発法人産業技術総合研究所 FILES APPLICATION FOR "METHOD FOR DECOMPOSING VULCANIZED RUBBER"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- BRIDGESTONE CORPORATION (1-1, Kyobashi 3-chome, Chuo-ku, Tokyo1048340), 株式会社ブリヂストン (東京都&#2... Read More

INTERNATIONAL PATENT: SONY GROUP CORPORATION, ソニーグループ株式会社 FILES APPLICATION FOR "DISPLAY DEVICE, LIGHT-EMITTING DEVICE AND LIGHT IRRADIATION METHOD"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- SONY GROUP CORPORATION (1-7-1 Konan, Minato-ku, Tokyo1080075), ソニーグループ株式会社 (東京都&#28... Read More

INTERNATIONAL PATENT: MIRAILAB BIOSCIENCE INC., ミライラボバイオサイエンス株式会社 FILES APPLICATION FOR "INFLAMMATORY CYTOKINE EXPRESSION INHIBITOR AND METHOD FOR INHIBITING EXPRESSION OF INFLAMMATORY CYTOKINE"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- MIRAILAB BIOSCIENCE INC. (1-14-4, Ginza, Chuo-ku, Tokyo1040061), ミライラボバイオサイエンス株&#24... Read More

INTERNATIONAL PATENT: IDEMITSU FINE COMPOSITES CO., LTD., 出光ファインコンポジット株式会社 FILES APPLICATION FOR "RESIN COMPOSITION, COATING MATERIAL OR INSULATING MATERIAL AND MOLDED BODY"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- IDEMITSU FINE COMPOSITES CO., LTD. (8-1, Higashiueno 4-chome, Taito-ku, Tokyo1100015), 出光ファインコンポジッ&#1248... Read More

INTERNATIONAL PATENT: SONY SEMICONDUCTOR SOLUTIONS CORPORATION, ソニーセミコンダクタソリューションズ株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND PROGRAM"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahi-cho, Atsugi-shi, Kanagawa2430014), ソニーセミコンダクタソ&#... Read More

INTERNATIONAL PATENT: FURUKAWA ELECTRIC CO., LTD., 古河電気工業株式会社 FILES APPLICATION FOR "CU-AG ALLOY WIRE MATERIAL"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- FURUKAWA ELECTRIC CO., LTD. (6-4, Otemachi 2-chome, Chiyoda-ku, Tokyo1008322), 古河電気工業株式会社 (東京&#37... Read More

INTERNATIONAL PATENT: AUTOLIV DEVELOPMENT AB, オートリブ　ディベロップメント　エービー, ISHIGAKI, RYOTA, 石垣　良太, ABE, KAZUHIRO, 安部　和宏 FILES APPLICATION FOR "OCCUPANT PROTECTION DEVICE"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- AUTOLIV DEVELOPMENT AB (Wallentinsvagen 22 44783 Vargarda), オートリブ　ディベロップメント&... Read More

INTERNATIONAL PATENT: MICROSPACE CORPORATION, マイクロスペース株式会社, TAIYO YUDEN CO., LTD., 太陽誘電株式会社 FILES APPLICATION FOR "MOTOR CONTROL DEVICE"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- MICROSPACE CORPORATION (7-14-402, Kitashinagawa 5-chome, Shinagawa-ku, Tokyo1410001), マイクロスペース株式会&#31038... Read More

INTERNATIONAL PATENT: DENSO CORPORATION, 株式会社デンソー FILES APPLICATION FOR "WINDING-FIELD-TYPE ROTARY ELECTRICAL MACHINE"

Posted On: 2025-02-17
Government News US Fed News

GENEVA, Feb. 17 -- DENSO CORPORATION (1-1, Showa-cho, Kariya-city, Aichi4488661), 株式会社デンソー (愛知県刈谷市&#26... Read More